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| Hebei I.T. (Shanghai) Co., Ltd. LED SPECIFICATION Part No./330MUV9C O Features/ l Single color/ l High bright output/ l Low power consumption/ 5.30.1 2.90.1 3.90.1 3.00.1 l High reliability and long life/ 0.80.1 CATHODE l Dice material/InGaN l Emitting Color/ Purple/ l Device Outline/ 3mm Round Type/ 3mm l Lens Type Water Clear/ 1.50.5 25.4Min 0.50.1 2.540.1 1. All dimensions are millimeters/mm. 2. Tolerance is +/-0.25mm unless otherwise noted/ 0.25mm. O Directivity/ DIRECTIVITY 1.0 0 Ta=25 C IF=20mA 30 Relative Luminous 0.5 60 0 90 60 30 0 0.5 90 1.0 Radiation Angle www.ledz.com 1/6 0.8Max O Descriptions/ Hebei I.T. (Shanghai) Co., Ltd. LED SPECIFICATION Part No./330MUV9C O Absolute maximum ratings/Ta = 25 Parameter Reverse Voltage Forward Current Power Dissipation Pulse Current Operating Temperature Storage Temperature HBM ESD Class Symbol VR IF Pd Ipeak Topr Tstr ESD Test Condition IR = 30A ------Duty=0.1mS1kHz ---------Values Min. 5 ----------40 -40 Max. -25 100 100 +85 +100 Class Unit V mA mW mA v O Electrical and optical characteristics/Ta = 25 Parameter Forward Voltage Reverse Current Dominate Wavelength Peak Wavelength Spectral Line half-width Luminous Power Viewing Angle www.ledz.com 2/6 Symbol VF IR d p P 21/2 Test Condition IF=20mA VR=5V IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA Values Min. ---------395 ---4 ---Typ. 3.5 ---------13 ---26 Max. 3.8 10 ---400 ---5 ---- Unit V A nm nm nm mW deg. Hebei I.T. (Shanghai) Co., Ltd. LED SPECIFICATION Part No./330MUV9C O Typical electrical/optical characteristic curves/ Fig.1 Vs. 50 40 30 20 10 0 3.2 Luminous Intensity Relative Value at IF=20mA 3.3 3.4 3.5 3.6 Forward Voltage(V) 3.7 Forward Current(mA) 2.5 Fig.2 Vs. 2.0 1.5 1.0 0.5 0 0 10 20 30 40 IF-Forward Current (mA) 50 Fig.3 Vs. 40 30 20 10 0 0 20 40 60 80 100 Relative Luminous Intensity 50 Forward Current(mA) 2.5 2.0 1.5 1.0 0.5 Fig.4 Vs. 0 -40 -20 Ambient Temperature TA () 40 60 0 20 Ambient Temperature TA () 80 90 Fig.5 Vs. Relative Luminous Intensity 100 75 / Purple 50 25 0 380 390 400 410 420 430 440 Wavelength (nm)/ www.ledz.com 3/6 Hebei I.T. (Shanghai) Co., Ltd. LED SPECIFICATION Part No./330MUV9C O Lead Forming/ 1. Any lead forming or bending must be done before soldering. 2. When forming leads, there must be a minimum of 2mm clearance between the base of the LED lens and the lead bend. 2 3. Avoid bending the leads at the same point more than once. 4. During assembly onto PCB, the lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement. O Soldering Condition/ Careful attention should be paid during soldering. When soldering, leave more then 2mm from solder joint to case, and soldering beyond the base of the tie bar is recommended. LED2mm Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. LED www.ledz.com 4/6 Hebei I.T. (Shanghai) Co., Ltd. LED SPECIFICATION Part No./330MUV9C Recommended soldering conditions/: Hand Soldering Temp.at tip of iron 300Max.(30WMax.) 300 30 Soldering time 3 sec Max. 3 Distance 2mm Min.(From solder joint to case) 2 DIP Soldering Preheat temp. 100 Max. (60 sec Max.) 10060 Bath temp. 260 Max 260. Bath time. 3 sec Max. 3 Distance 2mm Min 2. O Cleaning/ 1. Do not clean LEDs with water, Alcohol are recommended solvents for cleaning. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not. 2. LEDs may be damaged by ultrasonic-washed. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. LED O Storage/ 1. Environmental temperature: -40---100, Recommended: -20---50 -40---100-20---50 2. Environmental humidity: 30%---70%, Recommended: 40%---60% 30%---70%40%---60% www.ledz.com 5/6 Hebei I.T. (Shanghai) Co., Ltd. LED SPECIFICATION Part No./330MUV9C O Static Electricity/ 1. Static Electricity or power surge will damage the LED. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. LED 2. All production machinery and test instruments must be electrically grounded. 3. Maintain a humidity level of 50% or higher in production areas. 50% 4. Use anti-static packaging for transport and storage. www.ledz.com 6/6 |
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